 |
Recommended Results |
| |
|
|
| |
產品型錄 |
共4 筆 產品 |
|
| |
|
|
|
|
|
layer:1
meterial:Aluminium
board thickness:1.6mm
copper thickness:35um
surface:HASL
solder mask:white
legend:black
test:100%
the information about our company's process capacity hereinafter for you to reference.
number of layer:1-10
board ...
|
|
|
|
|
layer:6
meterial:FR-4
board thickness:2.0mm
copper thickness:35um
surface:Immesion gold
solder mask:Green
legend:white
test:100%
the information about our company's process capacity hereinafter for you to reference.
number of layer:1-10 ...
|
|
|
|
|
layer:2
meterial:FR-4
board thickness:1.6mm
copper thickness:18um
surface:Flash gold
solder mask:Green
legend:white
test:100%
the information about our company's process capacity hereinafter for you to reference.
number of layer:1-10
boar ...
|
|
|
|
|
layer:1
meterial:FR-4
board thickness:1.6mm
copper thickness:35um
surface:Immesion Gold
solder mask:Green
legend:white
test:100%
the information about our company's process capacity hereinafter for you to reference.
number of layer:1-10
...
|
|
|
|
|
